UltraGage

Product Highlights:

UltraGage 9900

• Standard for 180 µm node wafers
• Measures more than 38,000 data points
• Edge exclusion to 1 mm
• E-Plus technology emulation mode
• 200mm wafers (6 inch diameter wafers)

UltraGage 9700

• The standard for wafer dimensional metrology
• Measures 17,300 data points in 60 seconds
• Optional 2 mm edge exclusion
• E technology emulation
• Broad range of options
• 200 mm wafer shape thickness and flatness
• 250nm IC design node

UltraGage 9530-NT

• Thickness measurements of thin semiconductor wafers down to 150 µm
• Thin wafers
• Ideal for backgrind applications
• Measures 8,700 data points in under 60 seconds
• High bow/warp measurement capability
• Thin wafer/high warp wafer handling
• Graphical User Interface based on Windows-NT
• 200 mm wafer shape thickness and flatness

UltraGage 9520

• Measures 8,700 data points in under 60 seconds
• Semiconductor wafer thickness measurements from 250 µm to 750 µm
• Shape measurements to 1,100 µm
• Patterned, polished or taped wafer surfaces
• Backgrind and wafers with thermal change
• Expandable and upgradable
• 200mm wafers

UltraGage

• Thin film stress on patterned or monitor wafers
• Measures 8,700 data points in under 60 seconds
• Insensitive to film reflectivity or multilayer stacks
• Full wafer stress measurement to 3 mm from edge
• Wafer shape characterization

UltraGage 9500

• Multi-tool functionality including thickness, shape stress, global and site flatness
• Measures 8,700 data points in under 60 seconds
• Thin film stress on patterned or monitor wafers
• Wide range of options including wafer typing