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• Advanced defect classification by size and shape
• Discriminates and filters specific defects to reveal process signatures
• Fast, sensitive single scan
• Allows “Intelligent SEM Sampling”

Key Features:

• High sensitivity on blanket films
• Inspects surface to the edge – frontside or backside
• Bins particles and defects by type
• Small footprint
• Inline production throughput
• Reduces SEM sampling
• Patented Angular Resolved Scatter architecture

ADE's Film Inspection Tool (FIT) is a fully automatic surface scanning inspection system for defect detection and classification for upatterned films. The FIT may be used for process tool monitoring and process characterization. Proven effective on advanced film defects and engineered wafer films and substrates such as:

• Nitride
• Polymer
• Copper
• Epitaxial
• Dielectrics
• Poly film
• SOI
• Strained silicon
• Epitaxial
• Metals
• CMP (and copper CMP)
• Photoresist

Applications for this product

Thin Films Process Monitoring

Thin Films CMP

Thin Films Photoresist

SOI/SiGe Wafer Production

Particle/Defect Detection

Particle/Defect Classification

Related products

AWIS™ 3220

AcuMap™ 3220

AFS™ 3220

FabVision™