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Thin Films CMP Inspection

Inspect for defects after thin film chemical mechanical planarization:

  • Micro-scratches
  • Flakes vs. particles
  • High sensitivity identifies smaller defects

Classify defects on thin film CMP:

  • To isolate consequential defects from inconsequential
  • Classify unique process defects
  • Identify process related spatial patterns

Uses factory automation, 300mm edge grip for advanced IC designs. Inspect polymer and nitride wafers. At the same time as the surface scan, you can inspect for edge defects.

Inspect these and other films:

 

  • Nitride
  • Polymer
  • Copper
  • Epitaxial
  • Dielectric film
  • Poly film
  • Dark film
  • Metal film
  • CMP (and copper CMP)
  • Photoresist films

 

 

Products for this application:

 

Related applications

Thin films process monitoring

Photoresist

Epitaxial

Particle Defect Characterization

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