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Pre-Polish Geometry

• WaferCheck 7200

From slice, grind and lap to polish

• 100 mm to 200 mm wafers
• Up to 40 Sort Parameters
• ASTM/SEMI/JIS Standards
• Compatible with slice, grind, lap and polish
• Options: 10 nm Flatness Resolution, Bulk Resistivity, Laser Mark Reading, Visual Inspection Station, DECnet/Ethernet Interface SECS II/GEM Protocol

Metrology of unpolished wafers for semiconductor manufacturing requires insensitivity to reflectivity. A high resolution, high data density allows more precise characterization of wafer thickness and site and global flatness, resulting in tighter specifications during incoming inspection. These specifications are required by the device manufacturing processes.

ADE metrology equipment for pre-polished wafer geometry meets the SEMI, ASTM and JIS Standards for precision, parameters and performance. A broad base of installed platforms used for measuring unpolished semiconductor wafers provides proof of correllation, reliable field service, and easy transition to new unpolished wafer process control procedures.