CMP Wafer Geometry

Post Chemical Mechanical Planarization flatness, shape and wafer thickness

Compatible with the demands of chemical mechanical planarization (CMP) process monitoring, WaferSight CMP flatness measurement of wafer surface quality on 300 millimeter semiconductor wafers, and on advanced 200 millimeter wafers. The measurement data, which provides pass/fail criteria for CMP wafer flatness, shape, thickness and bow, are compatible with SEMI standards for design rules down to the 45 nanometer node, which reduces cost of ownership calculations significantly.

AFS measures CMP process results on 300mm double side polished wafers down for 130nm design rules and up. The system has been certified to be compatible with CMP process control and quality control needs.

UltraGage and UltraScan measure wafer geometry after CMP for their respective technology nodes and wafer sizes (200mm and down).

Post CMP Wafer Inspection

Inspect for defects and particles on thin film CMP:

• To isolate consequential defects from inconsequential
• Classify unique process defects
• Identify process related spatial patterns