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Backgrind Wafer Geometry

Application Highlights:

Thin wafer handling

ADE equipment has been adapted to and proven efficacious on thin wafers, featuring wafer handling for thin wafers with minimum breakage. While individual models vary, fail-safe sensors can be incorporated to minimize wafer breakage during handling and measurement.

A quick change end-effector overcomes wafer sag caused by both gravity and process while maintaining the ability to selectively pick and place thinned wafers from full or partial cassette of wafers.

Backgrind process monitoring

• Global wafer thickness, shape and flatness
• thickness and shape changes resulting from backgrind
• speeds production setup and ramp
• accurate, high resolution monitoring of dimensional output maintains and optimizes tool performance and OEE

Detect day-to-day production problems before they impact OEE or result in damaged or lost product wafers.

By measuring before and after states, subtraction profiles can be produced.