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Backgrind Characterization

MEMS wafer shape

Backgrind process monitoring

By measuring before and after states, subtraction profiles can be produced. Special software for ADE's equipment is able to measure, pre and post backgrind wafer shape, and, comparing the two measurements, wafer material removal.

In this way, the effects of backgrind polishing can be monitored, developed and characterized.

ADE data provides engineers with:

Global wafer thickness, shape and flatness
thickness and shape changes resulting from backgrind
speeds production setup and ramp
accurate, high resolution monitoring of dimensional output maintains and optimizes tool performance and OEE

Detect day-to-day production problems before they impact OEE or result in damaged or lost product wafers. Manage, review and analyze historical data using FabVision with UltraGage.

Note:

If you were looking for information about wear analysis or ball bearing wear, grinding or polishing characterization measurement, please look at this page on optical surface profilers.

Products for this application:

FabVision™ - wafer metrology management

Related applications

Post-polish wafer shape metrology

Thin films process monitoring

Photoresist

Epitaxial

Particle Defect Characterization

Backgrind wafer geometry

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