AFS 3220 FA

Wafer Dimensional Metrology System

AFS, for measuring silicon wafer thickness, flatness shape and resistivity.

Benefits:

300mm industry standard wafer shape measurements
Measures etched, polished, epi, SOI and reclaim wafers
High throughput and sorting
Worldwide measurement correlation

Features:

Reliable edge grip handling
Integral NIST traceable masters
1mm edge exclusion
300mm factory automation compliant
Bulk resistivity and conductivity type options

Advanced Flatness System

ADE's AFS™ Advanced Flatness System is the industry standard production and metrology tool for measuring thickness, flatness and shape of 300mm silicon, epi and SOI wafers. It provides accurate and precise measurements supporting the 130nm and 90nm site flatness (SFQR) technology nodes. The AFS system offers the optimal combination of measurement accuracy, clean handling, and high throughput for production wafer flatness and shape measurements.

3D wafer plot.

3D reclaim wafer plot.

Applications for this product

Thin Films Epi

SOI/SiGe Wafer Production

Post CMP Wafer Geometry

Polished wafer shape

Related products

AWIS 3220

FabVision™ - wafer metrology management

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