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9850 UltraScan

  • UltraScan 9850 wafer thickness metrology system

Product Highlights:

  • The standard for incoming inspection of 130nm generation wafers
  • Dimensional, resistivity and type measurements in one tool
  • E-Plus technology emulation mode
  • Fully automated calibration
  • Compact footprint

ADE's UltraScan 9850 with E-Squared™ Gage technology is the next generation industry standard for wafer geometry characterization and sorting. The 9850 meets SIA performance requirements for 200 mm wafer processing. With standard resistivity and optional type gages, the high data density, non-contact measurements and fully automated operation of the 9850 completely characterize wafer quality for silicon manufacturers and photolithography.

Incoming Quality Control

The clustered design of the 9850 enables sampling of wafer dimension, shape, flatness, resistivity and type in one metrology step. Options include a SECS interface to facilitate factory automation. The 9850 can identify material out of the specified range, before it causes yield loss in downstream processes. Supplier quality can be checked and monitored, and the worldwide correlation capability of ADE equipment eliminates the risk of inappropriate material acceptance or rejection. The 9800 version of UltraScan has 9850 features, with five configurable cassette stations.

Silicon Manufacturing

With both E Squared and E-Plus Emulation modes, the 9850 can characterize wafers for 130 nm and greater line widths. The broad range of capabilities, including 1 mm edge exclusion and site flatness, make the 9850 a versatile tool. Resistivity and type gauges can be added to completely characterize the dimensional and base electrical properties of outgoing material. The tighter accuracy and repeatability of the 9850 translates into higher yields at final inspection. With features such as automatic thickness calibration and storable calibration parameters, cost of ownership is reduced.

Programmable Resistivity Measurements

Non-contact resistivity measurements are taken in parallel with standard dimensional measurements, improving throughput. Users can program the system to determine resistivity at any point on the surface and in high or low ranges. Non-contact wafer typing is also available.

Applications for this product

Pre-Polish Wafer Geometry

Post-Polish Wafer Geometry

Incoming Wafer Quality

 

Related products

UltraScan® overview

9600 UltraScan

9650 UltraScan

9800 UltraScan - five cassette stations

FabVision™ - wafer metrology management

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