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9700 UltraGage

  • UltraGage 9700 wafer shape and thickness gauge (details vary)

200mm wafer flatness, shape and thickness metrology

Product Highlights:

  • The standard for wafer dimensional metrology
  • Measures 17,300 data points in 60 seconds
  • Optional 2 mm edge exclusion
  • E technology emulation
  • Broad range of options
  • 200 mm wafer shape thickness and flatness
  • 250nm IC design node

ADE's UltraGage 9700 with E-Plus technology is the industry standard for 250 nm design rule characterization. It meets SIA performance requirements for 200 mm wafer processing, edge exclusion and site flatness. The 9700 is ideal for checking outgoing wafer quality at silicon manufacturers. In IC fabs, it is also useful for sampling wafers at incoming wafer quality and photolithography.

High data density, non-contact measurements and fully automated operation makes the 9700 an ideal process analysis, development and control tool. With its broad range of capabilities, including an optional wafer typing gage and 2 mm edge exclusion, the 9700 is versatile and expandable for future needs.

Silicon Manufacturing

The UltraGage 9700 is the standard for dimensional metrology in the silicon wafer industry. With E technology emulation, the 9700 characterizes wafers for both 250 nm and greater line widths. Tighter accuracy and repeatability of the 9700 translates into higher yields at final inspection. Optional features include dual cassette handler and noncontact type measurement.

Lithography

Global and site flatness data can be used to predict photolithographic yield based on wafer geometry. Reference site and global focus plane combinations can be selected to optimize stepper leveling and focus characteristics. Site layout, size, offset and reference planes of a stepper recipe can be emulated to improve lithographic yield.

Incoming Quality Control

Using ADE’s industry standard measurements, the 9700 can identify out-of-specification wafers before they cause yield loss in downstream processes. Supplier quality can be checked and monitored.

Applications for this product

Pre-Polish Wafer Geometry

Post-Polish Wafer Geometry

Backgrind Wafer Geometry

Thin Film Stress

 

Related products

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