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UltraGage® 9530-NT

Thickness and shape metrology for very thin wafers

Product Highlights:

• Handles very thin wafers
  • Thickness: 125 to 775µm

• Measures highly shaped wafers
  • Bow, warp to 1100µm
• 10nm resolution
• 100, 125, 150 and 200mm wafers
• 3mm edge exclusion
• Thickness, global flatness, bow, warp
• Optional film stress software
• Bare, filmed, patterned or taped wafers
• Graphical user interface

Product Highlights:

• Single cassette AutoLoader
• Thin wafer end effectors
• SECS II/GEM protocol
• Device ToolBox for analysis
  • Stress calculation option
• FabVision integration

 

The 9530-NT extends ADE's industry standard metrology to backgrind, etch and lap processes that reduce wafers to 150 µm thickness. With an enhanced wafer handing system and a Windows-NT Graphical User Interface, the 9530-NT is designed for production operations that demand high performance metrology for equipment set-up, process qualification and on-going process control of their next generation wafer thinning processes. Well adapted for use between lithography and dicing processes.

150 µm Wafer Measurement and Handling

Working closely with its extensive worldwide customer base, ADE has developed the 9530E Gage technology to measure wafers as thin as 150 microns (150µm wafer thickness) while maintaining ADE's industry-leading data density. In addition to an expanded shape measurement range, 9530-NT keeps the wafer safely centered within its dynamic measurement range. Fail-safe sensors have been incorporated to minimize wafer breakage during handling and measurement. A quick change end-effector overcomes wafer sag caused by both gravity and process while maintaining the ability to selectively pick and place thinned wafers from full or partial cassette of wafers.

Graphical User Interface

ADE's next-generation TSC controller and software, gives the 9530-NT new capabilities that enhance user productivity and factory integration. A Graphical User Interface based on SEMI guidelines and running under Windows-NT make tool set-up, operation and preventive maintenance intuitive. Seamless integration with Wintel networks, a SECS/GEM interface and the ability to use the wide array of Windows-compatible peripherals means no shortage of future features, upgrades and options.