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UltraGage® 9520

Product Highlights:

  • Benchtop metrology for 100 to 200mm wafers
  • Wide measurement range
    • Thickness 250 to 750µm
    • Bow, warp to 1100µm
  • 100nm resolution
  • 100, 125, 150 and 200mm wafers
  • Thickness, flatness, bow, warp
  • Optional film stress software
  • Bare, filmed, patterned or taped wafers
  • Upgradeable to UltraGage 9500 specifications

 

Productivitiy Options:

  • Single or dual Autoloader
  • DECnet/Ethernet interface
  • SECS II/GEM protocol
  • DeviceToolbox for analysis
    • Stress Module
    • Site Flatness Module
  • FabVision integration

 

The 9520 UltraGage is designed for those needing ADE’s industry standard thickness, shape and global flatness measurements at a competitive price. Using a derivative of E Gage technology found in ADE’s industry standard 9500, the 9520 can help process engineers qualify and monitor backgrind, lap or etch processes needing 1 µm thickness accuracy. With its large shape range, the 9520 is also ideal for characterizing the shape of wafers subjected to repeated thermal cycling, such as furnace baffle or monitor wafers.

ADE Performance at a Competitive Price

Gathering up to 8,700 thickness and shape data points in a minute or less, the 9520 enables process engineers to diagnose equipment setup and process degradation problems not usually detectable using low resolution fixed probe systems. Its ability to measure wafers between 250 µm and 750 µm of thickness, without the need to recalibrate, means higher tool utilization.

Compare the rest of the UltraGage family of products.

Applications for this product

Backgrind Wafer Geometry

Backgrind Characterization

Thin Films Process Monitoring

Thermal Shape Change

Pre-Polish Wafer Geometry

Post-Polish Wafer Geometry

Thin Film Stress

 

Related products

UltraGage overview

UltraGage 9500

UltraGage 9530-NT

UltraGage 9700

UltraGage 9900

UltraScan

FabVision™ - wafer metrology management

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