UltraGage® 9500

UltraGage 9500 benchtop wafer metrology system

Benchtop sorter for 100mm to 200mm wafers

Product Highlights:

10nm resolution
100, 125, 150 and 200mm wafers
Thickness, flatness, bow, warp
Bare, filmed, patterned or bumped wafers
Optional stress measurement
Optional conductivity type
SEMI standard measurements
NIST traceable thickness masters
Worldwide measurement correlation

Productivity options:

Wafer Shape measurement comparison using Device ToolBox

Single or dual AutoLoader
DECnet/Ethernet interface
SECS II/GEM protocol
ReportTools application
RecipeTools for setups
MultiReport tool interconnect
Device Toolbox for analysis
FabVision Integration

ADE’s UltraGage 9500 is a versatile, multifunctional tool that measures wafer thickness, shape and flatness. High data density, non-contact measurements and fully automated operation make the 9500 an ideal full functional analysis, development and control tool.

Applications include outgoing wafer quality checks at silicon wafer manufacturers, sampling incoming wafer quality at IC fabs, thin film stress measurements and shape of wafers used in thermal processes. Monitor wafer quality in chemical mechanical planarization (CMP) and thin film deposition processes.

Site Flatness

Standard on the 9500, real time site flatness measurements are used to qualify wafers for their suitability for lithographic processes. Site size and offset can be varied to qualify the flatness of user specific image layouts, preventing out of specification wafers from entering the IC fabrication process.

Stress

The 9500’s optional stress measurement is not sensitive to film type, reflectivity or other optical abberations found in optically based stress measurement systems. The large number of data points results in highly detailed stress measurements to within 3 mm from the edge. Stress and off-line analysis software can be added eliminating the need to purchase a separate stress measurement tool.